To avoid the loss caused by counterfeit and inferior products from the semiconductor market, and to make sure that the authority and reliability of the used products, Winking cooperates with the third party, authorized testing organization, to provide the following testing services:
X-Ray Inspection: An internal component inspection via an X-ray machine, which is an inspection of the short/open circuit and line link inside a component.
De-cap Inspection: A destructive method to inspect and analyze, which is to unpack the external package (usually silicon) to test the wafer code and the internal condition.
Program Test: An approach often conducted to test internal memory chips and other memory chips, especially for OTP, which is to erase, to do blank test, and to burn, analyze calculate and affirm the SUM value.
Electric Performance Test: A way to test the electric performance between the leads, such as current, voltage, resistance, the connectivity condition of the silicon, etc. Tracking curve test has high value and authority in benign analysis and reliability test. This kind of test can confirm the authenticity of chips and whether it’s destroyed by ESD/MSL. During the test, chips generate tracking curve in certain profiles, and the qualified chips present a curve graph exactly the same to the given graph or within the allowable error range that is explained in product information.
Key Functional test: A way to imitate the platform of specific application environment and test to ensure the realization of each function. During the period, energize the device tested to drive the chip and imitate the PCB working condition to test the key functions.